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Screen Printing Machine

EKRA is best known for their SMT Stencil Printers. For several decades, they have also been producing print systems for various industry segments outside of SMT-applications.

This includes

  • Printing of ultra-fine structures,
  • 3D shapes
  • Functional coatings on different materials including glass, ceramics, LTCC/HTCC, foils, metal tubes, wafers and textiles.

General Specification

Material size1x1mm up to1.600×2.000mm

Cycle timedown to 0.8 seconds/ part

Structuresdown to 18µm

Alignment Accuracydown to +/-3µm

Features & Options

  • Automatic looking setup of all print parameters
  • Alignment accuracy +/-10 μm @ 6 Sigma
  • Dedicated unique print nest and table solutions
  • Automatic loading
  • Automatic screen exchange
  • Curing, IR or UV unit
  • 3D measuring system,
  • 100% inline inspection
  • Precise adjustment of the snap lock
  • Different types of levy
  • Motorized squeegee head
  • Stencil cleaning system iROCS
  • Dispensing systems

Machines

Manual alignment

machine

E2

  • Since 2014
  • Print frame with 4 pillar guides for highest precision and repeatability
  • Printing area up to 300 x 300 mm (12 inch)
  • Patented optical positioning system EVATM – EKRA Vision
  • Alignment System using edge recognition, fiducial recognition or
  • 2 independent pneumatic driven print heads with precision proportional valves with closed-loop control
  • Closed loop for printer alignment Automatic loading/unloading possible Alignment repeatability ± 5 μm @ 3 Sigma
Maschinen Dimensionen / Machine dimensions E2 E2XL
Länge x Breite x Höhe / Length x width x heightGewicht / Weight 1450 x 1150 x 1400 mmca / approx. 550 kg 1700 x 1300 x 1400 mmca /approx.650 kg
Installation requirements
Elektrischer Anschluss / Power requirementsLeistungsaufnahme / Power consumptionAbsicherung / Fuse protectionPneumatischer Anschluss / Air supplyLuftverbrauch / Air consumption 230 V AC;50 / 60 Hz; 1L+N+PE1,2 kW16 A6 – 10 bar1,5 Nl/min 230 V AC;50 / 60 Hz; 1L+N+PE1,2 kW16 A6 – 10 bar1,5 Nl/min
Rakel / Print parameters
Rakelgeschwindigkeit / Print speedRakeldruck / Print pressureRakelmode / Print mode 10 – 170 mm/s10 – 250 NDruck – Druck / Print – PrintDruck – Fluten / Print – FloodFluten – Druck / Flood – PrintWechseldruck / Alternating print 10 – 170 mm/s10 – 250 NDruck – Druck / Print – PrintDruck – Fluten / Print – FloodFluten – Druck / Flood – PrintWechseldruck / Alternating print
Druckgut / Print material (X/Y)
Rahmengröße min. / Frame size min.Rahmengröße max. / Frame size max.Druckformat max. / Print format max.Druckgutstärke / Print material thickness 300 x 300 mm620 x 740 mm370 x 450 mm0,8 – 6,0 mm 300 x 300 mm620 x 740 mm370 x 450 mm0,8 – 6,0 mm
Prozess / Machine capability
Ausrichtgenauigkeit / Alignment accuracy ± 10 μm ± 10 μm
Aufstellbedingungen / Installation requirments
Temperatur / TemperatureFeuchtigkeit / Humidity 25°C +/- 10°C50%+/- 20% (nicht kond.) /(non cond.) 25°C +/- 10°C50%+/- 20% (nicht kond.) /(non cond.)

M2H

  • The M2H semi-automatic screen printer has been designed for printing of ceramic hybrids in applications with small to medium size production volumes, R&D and laboratory as well as proto-typing purposes.
  • But also a large variety of other flexible and rigid substrates up to a size of 180 x 160 mm can be processed on the M2H. The substrates can be placed on to different types of print nests mounted on the horizontally moving table. For a convenient substrate alignment, the printer can optionally be equipped with the manual optical positioning system MOPS. The substrate is then manually aligned using high resolution cameras for reliable recognition of fiducials or other layout features.
Machine dimensions
Length x width x height 1150 x 1000 x 1340 mm
Weight 440 kg
Installation requirements
Power requirements 230 V AC ; 50 / 60 Hz, 1L+N+PE
Fuse protection 2 kW
Air supply 6-10 bar
Air consumption 40 Nl/min
Print parameters
Print speed 10 – 200 mm/s
Print pressure 10 – 200 N
Print mode Print – PrintPrint – FloodFlood – PrintAlternating print
Print material (X/Y)
Frame size min. 203 x 152 mm
Frame size max. 305 x 305 mm
Print format max. 180 x 160 mm
Print material thickness max. 30 mm
Positioning manual
Print material (X/Y)
Alignment accuracy ± 7,5 μm
Installation requirements
Temperature 25°C +/- 10°C
Humidity 50% +/- 20% (nicht kond.) / (non cond.)

Automatic alignment

XH-STS

  • The XH STS stencil and screen printing system was specially developed for printing substrates in thick film applications. The flexible system can be used in a wide number of areas within the hybrid, SMT and solar fields. The automatic offljne prjnt system is particularly suitable for thickfilm printing of small to mid-range production volumes which require highest precision and short tooling times.
  • A porous stone is used as the standard print nest which means that all flat substrates can be positioned on the pant table, independent of their form, Even very thin materials such as wafers,solar cells. tapes or foils can be accurately printed. An additional advantage is that the incurred costs for specific print nests can be avoided Customer-specific pant nests are available upon request.

Automatic inline

Machine dimensions
Length x width x height 1498 x 1460 x 1552 mm
Weight 930 kg
Installation requirements
Power requirements 400V AC; 50 / 60 Hz 3L+N+PE
Power consumption 2,3 kW
Air supply 6-10 bar
Air consumption 2 Nl/min
Print parameters
Print speed 10 – 300 mm/s
Print pressure 10 – 250 N
Print mode Print – PrintPrint – FloodFlood – PrintAlternating print
Print material (X/Y)
Frame size min. Up to 450 x 450 mm with adapter frame
Frame size max. 584 x 740 mm with screen support rail
Print format max. 300 x 300 mm
Substrate thickness 0,1 – 20 mm
Positioning Edge recognition, fiducial recognition and synthetic fiducials
Machine capability
/ Alignment repeatability ± 10 μm @ 6 Sigma
Installation requirements
Temperature 25°C +/- 10°C
Humidity 50% +/- 20% (nicht kond.) / (non cond.)

XW-STS

  • The flexible machining cell is designed for front or back side printing (bumping or wafer backside coating) on round wafers. The system consists of two main modules, a loading unit and a printing system. The loading unit in turn consists of three components a magazine unloading system, a robot unit and a pre-align station.
  • The magazine unloading system is equipped with two magazine positions from where the wafers are fed to the machine. The 3-axis robot unit with vacuum end effector ensures a stress-free wafer transport. Using a flexible pick-up, different end effectors can be used even for very thin or curved wafers.
Machine dimensions
Length x width x height, Weight 2550 x 1460 x 1552 mm, 1950 kg
Installation requirements
Power requirements 400V AC; 50 / 60 Hz 3L+N+PE
Power consumption 2,3 kW
Air supply 6-10 bar
Air consumption 2 Nl/min
Print parameters
Print speed, Print pressure 10 – 300 mm/s, 10 – 250 N
Print material (X/Y)
Frame size min. Up to 450 x 450 mm with adapter frame
Frame size max. 584 x 740 mm with screen support rail
Print format max. 300 x 300 mm
Print material thickness 0,1 – 20 mm
Positioning Edge recognition, fiducial recognition and synthetic fiducials
Machine capability
Alignment repeatability ± 10 μm @ 6 Sigma
Installation requirements
Temperature 25°C +/- 10°C
Humidity 50% +/- 20% (non cond.)

Automatic inline

XH2

  • The XH2 screen and stencil print system has been specially developed for printing hybrids, with a particular emphasis on combining highest precision with maximum flexibility.
  • This inline print system utilizes the patented EVATM – EKRA Vision Alignment System. The EVATM system is an optical positioning system with a free-moving camera. Both the camera axis and the screen adjustment assembly have integrated high precision measuring systems which together ensure a repeatability of ± 12,5μm@ 6 Sigma.
Machine dimensions
Length x width x height 1000 x 1440 x 1550 mm
Weight 880 kg
Installation requirements
Power requirements 400 V AC; 50 / 60 Hz, 1L + N + PE
Power consumption 2,3 kW
Air supply 6-10 bar
Air consumption 2,5 Nl/min
Print parameters
Print speed 10 – 300 mm/s
Print pressure 10 – 250 N
Print mode Print -PrintPrint – FloodFlood – PrintAlternating print
Print material (X/Y)
Frame size min. Up to 450 x 450 mm with adapter frame
Frame size max. 584 x 740 mm with screen support rail
Print format min. 2 Zoll x 2 Zoll
Print format max. 250 x 250 mm
Print material thickness 0.1 – 1.5 mm
Positioning Edge recognition, fiducial recognition, synthetic fiducials
Machine capability
Alignment repeatability ± 12,5 μm @ 6 Sigma
Cycle time 3,5 s + print time
Installation requirements
Temperature 25°C +/- 10°C
Humidity 50% +/- 20% (non cond.)

XH1

  • Fastest cycle times and High Precision are the key features of the fully automated XH1 screen printer. The XH1 is the high-end solution for printing of ceramic substrates.
  • Its design is unique on the market and is based on excellent experience over many decades in the hybrid market.
  • The overall throughput of the system is in the range of 3,2 s including printing and is not only the result of a short handling time but includes as well the fully automated screen alignment. The extremely easy product changeover can be reduced to about 1 min and can be performed as well by low level instructed operators.

Print parameters

Machine dimensions
Length x width x height 1000 x 1440 x 1550 mm
Weight 840 kg
Installation requirements
Power requirements 4230 V AC; 50 / 60 Hz, 1L+N+PE
Power consumption 2,3 kW
Air supply 6-10 bar
Print speed 10 – 300 mm/s
Print pressure 10 – 250 N
Print mode Print -PrintPrint – FloodFlood – PrintAlternating print
Print material (X/Y)
Frame size min. 350 x 350 mm
Frame size max. 450 x 450 mm
Print format min. 4 Zoll x 4 Zoll
Print format max. 6 Zoll x 7 Zoll
Print material thickness 0,1- 1,5mm
Positioning Edge recognition
Machine capability
Alignment repeatability ± 12,5 μm @ 6 Sigma
Cycle time 3,2 s incl. print

XH3

  • The automatic screen printing system XH3 is perfectly equipped for thick-film applications. It comes with a transport system, which has been specifically designed for the processing of abrasive materials (ceramics), Furthermore, the printer is equipped with a product specific vacuum print nest and a customized print head for screen printing applications.
  • A camera allows the identification of structures of the screen. In the ceramic division, the printing system can be used for substrates in a size of between 4 and 7 inches (thickness 0.63 mm).Optionally, small and thin substrates up to 2×2 inches (thickness 0.35 mm) are easy to process. With specific adapter bars the XH3 can also be used with casted profile frames, in addition to conventional frame profiles.

Print material (X/Y)Installation requirements

Machine dimensions
Length x width x height 1140 x 1700 x 1488 mm
Weight ca. 1000 kg
Installation requirements
Power requirements 400 V AC, (480 V AC); 50 / 60 Hz 3L+N+PE
Power consumption 2 kW
Fuse protection 16 A
Air supply 5 – 6 bar
Air consumption 1,5 Nl / min
Frame size min. 350 x 350 mm
Frame size max. 740 x 740 mm
Print format min. Ceramic: 4 x 4 inches’, 2 x 2 inches’Others: 80 x 50 mm
Print format max. Ceramic: 7 x 7 inches others: 508 x 508 mm2
Substrate thickness 0,63 bis 6 mmoptional 0,35 mm3
Positioning Fiducial recognition
Machine capability
Repeat accuracy ± 12.5 μm @ 6 Sigma
Frame size max. 450 x 450 mm
Cycle time 12 s + print time(optional 5 s + print time )
Temperature 25°C +/- 10°C
Humidity 50% +/- 20%(non cond.)

XL3

  • Sizes up to: 1,5m
  • Substrate weight up to 10 kg
  • Alignment, optical edge and structure, mechanical mid centering alignment
  • Special guidance free transport- and automation units
  • Movable camera, only XL3, as an option

Print material (X/Y)Installation requirements

Machine dimensions
Screen size max. 1800 x 1200mm
Print size max. 1200 x 800mm
Thickness max. 10mm
Installation requirements
Machine capability

Customized Production Lines

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